CFD Modeling on Influence of Impinging Spout Strength for Device Cooling with Water-Al2O3 Nanofluid
N. K. Kund
N. K. Kund, Department of Production Engineering, Veer Surendra Sai University of Technology, Burla (Sambalpur), Odisha, India.
Manuscript received on 02 July 2019 | Revised Manuscript received on 09 July 2019 | Manuscript published on 30 August 2019 | PP: 1776-1779 | Volume-8 Issue-10, August 2019 | Retrieval Number: J91660881019/2019©BEIESP | DOI: 10.35940/ijitee.J9166.0881019
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© The Authors. Blue Eyes Intelligence Engineering and Sciences Publication (BEIESP). This is an open access article under the CC-BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0/)
Abstract: Current assessment get through to the effect of spout strength aimed at spout impact cooling through water-Al2O3 nanofluid. CFD codes got established to compute the governing equalities of mass, force and drive for envisaging the thermal issues. CFD codes got executed through water-Al2O3 nanofluid spouts to envisage thermal issues on the chosen plate. It uses 3 mm nozzle dimension, 5 mm nozzle to plate distance and varying spout strengths of 42, 52, 62 and 72 m/s. As projected from every temperature arena, the temperature gently grows from spout impact spot on chosen plate along centrifugally peripheral course. This could stand because of thermal outflow using water-Al2O3 nanofluid. The developments of temperature disparities alongside the radial course aimed at the identified cases are really similar. Still, the extreme temperatures over the chosen plate for situations with spout strengths of 42, 52, 62 and 72 m/s are detected to remain 320, 315, 310 and 308 K, respectively. It may be witnessed that there is no such significant decrease in temperature from spout strength of 62 to 72 m/s (involving loss of extra mechanical power). Hence, the spout strength of 62 m/s embraces rather lesser mean temperature and so, it stands as the ideal one.
Keywords: CFD Codes, Spout Strength, Thermal Control,
Water-Al2O3 Nanofluid
Scope of the Article: Thermal Engineering