Design and Analysis of MEMS Piezoresistive Three Layers Microcantilever-based Sensor for Biosensing Applications
Vinod Jain1, Saurav Verma2
1Prof. Vinod Jain, Department of Electronics, Mukesh Patel Technology Management and Engineering, NMIMS, Mumbai (Maharashtra), India.
2Mr. Saurav Verma, Department of Electronics and Telecommunication, Mukesh Patel Technology Management and Engineering, NMIMS, Mumbai (Maharashtra), India.
Manuscript received on 15 April 2013 | Revised Manuscript received on 22 April 2013 | Manuscript Published on 30 April 2013 | PP: 139-142 | Volume-2 Issue-5, April 2013 | Retrieval Number: E0696042413/13©BEIESP
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© The Authors. Blue Eyes Intelligence Engineering and Sciences Publication (BEIESP). This is an open access article under the CC-BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0/)
Abstract: The field of Microtechnology and Micro-Electro Mechanical Systems (MEMS) has grown exponentially during the previous two decades .This work is dedicated to finite element (FE) 3Dstructural modeling of three layers micromechanical sensors in ANSYS 13.0 gives 3D model which are close to reality mathematical models. Material used in cantilever for different layers are silicon-dioxide, poly-silicon and nitride. . The emphasis of the analysis is put on tile effects of the angle of inclination of the concentrated force upon the deformed shape, the load-deflection relationship stresses and strain for further analysis with a greater degree of accuracy. The model we made is three layers microcantilever where the centre layer i.e. second layer, is piezoresistive layer that helps to calculate Characteristics i.e. deflection, deformation, stress and strain in the cantilever for the given applied force that can we used for future analysis for the detection of biomolecules in various biosensing application.
Keywords: Microcantilever, Piezoresistive, Young Modulus and Elasticity.
Scope of the Article: Standards for IoT Applications