Central Processing Unit Binary Cooling System using Tetra fluoroethane as Refrigerant
Elmer Dollera1, Rogelio Golez, Jr.2, Jameson Almedilla3, Fraian Libao4, Fredrick Mhar Talanda5
1Elmer B. Dollera*, Professor of Xavier University, Cagayan de Oro City, Philippines.
2Rogelio C. Golez, Jr., Professor of Xavier University, Cagayan de Oro City, Philippines.
3Jameson R. Almedilla, Assistant Plant Performance Engineer in GN Power, Ltd. Co., Kauswagan, Lanao del Norte, Philippines.
4Fraian B. Libao, a Local Unit Operator Under the Operations Department of STEAG State Power, Inc., Villanueva, Misamis Oriental, Philippines.
5Fredrick Mhar C. Talanda, a Mechanical Engineering Supervisor of Pilipinas Kao, Inc., Jasaan, Misamis Oriental, Philippines.
Manuscript received on November 15, 2019. | Revised Manuscript received on 24 November, 2019. | Manuscript published on December 10, 2019. | PP: 1607-1612 | Volume-9 Issue-2, December 2019. | Retrieval Number: B7328129219/2019©BEIESP | DOI: 10.35940/ijitee.B7328.129219
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© The Authors. Blue Eyes Intelligence Engineering and Sciences Publication (BEIESP). This is an open access article under the CC-BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0/)
Abstract: Electronic devices and instruments generate heat that can cause serious damage and low efficiency towards its components. The heat that the different electronic elements and components emit can decrease both efficiency and life capacity of the device. And with the increase of use of electronic devices in industries and processes, heat dissipation in electronic devices should be taken into strict consideration. This study aims to develop a cooling system under vapor compression refrigeration system. The prototype fabricated was designed for the cooling system of two Central Processing Units of desktop computer which can be as good equivalent for the electronic devices in industries. Though ventilation was present in the processing units, certain condition such as condition in surroundings can be of great help to improve the device efficiency. This study also aims to analyze the CPU’s efficiency in relation to lowering ventilation temperatures. The vapor compression refrigeration system will be the main device used for lowering and maintaining a suitable temperature inside the CPU casing. The system works like a centralized air-conditioning system wherein the air from the surroundings will be cooled down by the evaporator in the vapor compression refrigeration system. The cooled air will then be delivered to the CPU through the installed air ducting connections. The recording of CPU’s efficiency is provided by the installed software. It also measures the air conditioned parameters and computation of the CPU power consumption. The results from the test and the analysis of the gathered data showed that 165 watts of heat dissipated was removed by the cooling system and the CPU performance index rose up from 424 to 446 with a discharge air temperature of 29.67 oC. Based from the result, the fabricated binary cooling system is efficient enough to increase the performance index of the CPU and absorbing heat dissipated by the device.
Keywords: Binary Cooling System, Central Processing Unit, Tetraflouroethane, Vapor Compression Refrigeration System
Scope of the Article: Refrigeration and Air Conditioning