Design of Heat Sink and Thermal Analysis for Electronics Applications
Ramesh.T1, Ramesh.V2, Karthik.K3
1Ramesh.T, Mechanical, Vel Tech Rangrajan Dr. Sagunthala R&D Institute of Science and Technology, Avadi.
2Ramesh.V, Mechanical, Vel Tech Rangrajan Dr.Sagunthala R&D Institute of Science and Technology, Avadi.
3Karthik. K, Mechanical, Vel Tech Rangrajan Dr. Sagunthala R&D Institute of Science and Technology, Avadi.
Manuscript received on 29 August 2019. | Revised Manuscript received on 08 September 2019. | Manuscript published on 30 September 2019. | PP: 4091-4094 | Volume-8 Issue-11, September 2019. | Retrieval Number: K17450981119/2019©BEIESP | DOI: 10.35940/ijitee.K1745.0981119
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© The Authors. Blue Eyes Intelligence Engineering and Sciences Publication (BEIESP). This is an open access article under the CC-BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0/)
Abstract: The now days electronics compound very important of human life its high temperature generated during operating, it is problem take in account in this paper, so overcome this problem need to thermal management. When the increase the temperature due to reduce the compound life time. In this paper to analysis using Finite element analysis focuses on the passive cooling of electronics devices by using fin configuration, different heat flux, and materials like aluminum (6062), Copper, Tungsten to ensure lower temperature compare with maximum operating temperature, all electronic components generate heat during of their operation. To ensure best working of the electronics component, the produced heat needs to be removed using thermal management techniques. Finally more heat dissipated material with design aspect Tungsten suitable material for high input power for electronic compounds because the thermal conductivity high and low thermal gradient. Keywords:
Keywords: Heat dissipation, Electronics compound, High thermal conductivity materials.
Scope of the Article: Thermal Engineering.