Computational Heat Transfer Analysis in Electronics using Piezo Electric Fan Arrays
T. Anup Kumar1, Neela Asha Swapna2, S. Shashidhar3
1T.Anup Kumar, Professor, Department of Mechanical Engineering, Koneru Lakshmaiah Education Foundation, Guntur (A.P), India.
2Neela Asha Swapna, Department of Mechanical Engineering, Koneru Lakshmaiah Education Foundation, Guntur (A.P), India.
3S.Shashidhar, Department of Mechanical Engineering, Koneru Lakshmaiah Education Foundation, Guntur (A.P), India.
Manuscript received on 07 April 2019 | Revised Manuscript received on 20 April 2019 | Manuscript published on 30 April 2019 | PP: 1831-1835 | Volume-8 Issue-6, April 2019 | Retrieval Number: F4082048619/19©BEIESP
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© The Authors. Blue Eyes Intelligence Engineering and Sciences Publication (BEIESP). This is an open access article under the CC-BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0/)
Abstract: Thermal design of miniaturized electronic equipment is becoming challenging with increased heat fluxes, acoustic disadvantages with enhanced noise from fans that cause forced convective cooling and also restriction in space for the placement of fans itself. Present study aims at evaluating the efficiency of a micro piezo electric fan in cooling a heat sink (20*20) mm2 provided with an array of pin fins (6*6). FLOTHERM is used to do the CFD analysis and heat transfer analysis to determine the optimized spacing of fins.It is found that the best configuration has reduced the hot spot temperature from 1670C to 64.10C.
Keyword: FLOTHERM, Piezo Electric Fan, Thermal Cooling in Electronics FLOTHERM, Piezo Electric Fan, Thermal Cooling in ElectronicsFLOTHERM, Piezo Electric Fan, Thermal Cooling in Electronics.
Scope of the Article: Heat Transfer